Oxygen Free Copper

High Purity OFC C10100 C10200 Copper

Oxygen free copper is a high-purity copper material with extremely low oxygen content, offering superior conductivity, reliability and performance for demanding applications.

What is Oxygen Free Copper?

Oxygen free copper (OFC) is a high-purity copper material manufactured through a controlled refining process to minimize oxygen content. It contains extremely low oxygen levels while maintaining excellent electrical conductivity, thermal conductivity and ductility.

Compared with standard electrolytic tough pitch copper (ETP copper), oxygen free copper provides improved purity, better hydrogen embrittlement resistance and higher reliability in demanding applications.

Oxygen free copper is widely used in semiconductor manufacturing equipment, vacuum components, electronic devices, high-frequency electrical systems, heat exchangers and precision industrial applications where purity and conductivity are critical.

Chemical Composition of Oxygen Free Copper

Oxygen free copper grades are mainly classified according to copper purity and oxygen content. The most common grades are C10100 and C10200 according to ASTM specifications.

Grade Copper Content Oxygen Content Main Characteristics
C10100 OFE Copper ≥99.99% <0.0005% Highest purity, excellent conductivity, vacuum applications
C10200 OF Copper ≥99.95% <0.001% High conductivity and good fabrication performance
C11000 ETP Copper ≥99.90% 0.02-0.05% General electrical and industrial applications

Physical Properties of Oxygen Free Copper

Property Typical Value Unit
Density 8.89 g/cm³
Electrical Conductivity 101-102 % IACS
Thermal Conductivity 390-400 W/m·K
Melting Point 1083 °C
Oxygen Content <0.001 %

Mechanical Properties of Oxygen Free Copper

Mechanical properties of oxygen free copper depend on manufacturing condition. Cold working can significantly improve strength while maintaining excellent conductivity.

Condition Tensile Strength Yield Strength Elongation
Annealed 200 MPa 60 MPa 45%
Half Hard 250 MPa 180 MPa 25%
Hard Temper 350 MPa 300 MPa 5%

Comparison of Oxygen Free Copper Grades

Grade Standard Purity Typical Applications
C10100 ASTM B170 99.99% Copper Semiconductor, vacuum, high-frequency equipment
C10200 ASTM B170 99.95% Copper Electrical and industrial applications
C11000 ASTM B152 99.90% Copper General electrical components

Manufacturing Process of Oxygen Free Copper

Oxygen free copper requires strict manufacturing control to maintain extremely low oxygen content and high electrical performance.

  1. High Purity Raw Material Selection: Electrolytic copper cathodes with high purity are selected.
  2. Vacuum or Controlled Atmosphere Melting: Oxygen absorption is minimized during melting.
  3. Continuous Casting: Copper billets are produced with uniform structure.
  4. Hot Rolling and Extrusion: Products are formed into plates, tubes and bars.
  5. Cold Working: Improves dimensional accuracy and mechanical strength.
  6. Annealing Treatment: Restores ductility and optimizes microstructure.
  7. Final Inspection: Conductivity, purity and dimensional inspection are performed.

Key Features of
Pure Copper

Pure copper provides excellent comprehensive performance and is widely selected for applications requiring high conductivity and corrosion resistance.

  • Excellent Electrical Conductivity: Pure copper has one of the highest electrical conductivity levels among engineering metals.
  • Superior Thermal Conductivity: Efficient heat transfer performance makes it ideal for heat exchangers and cooling systems.
  • Outstanding Corrosion Resistance: Forms a protective oxide layer in many atmospheric and industrial environments.
  • Excellent Ductility: Easy to bend, draw, form and manufacture into complex shapes.
  • Good Weldability: Suitable for various fabrication processes.
  • Recyclability: Copper can be recycled repeatedly without losing performance.

Electrical Performance of Oxygen Free Copper

Oxygen free copper is one of the best conductive copper materials available for electrical applications. Its extremely low oxygen content reduces impurities and electron scattering, allowing electrical current to flow with minimal resistance.

Compared with standard copper grades, OFC provides higher conductivity stability, especially under high-frequency current conditions. This makes it suitable for precision electrical components, power transmission equipment and electronic systems requiring reliable conductivity.

Material Electrical Conductivity Characteristics
Oxygen Free Copper C10100 101-102% IACS Highest conductivity, ultra-low oxygen content
C10200 Oxygen Free Copper 100% IACS Excellent conductivity and reliability
C11000 Electrolytic Copper 100% IACS General electrical applications
Brass 20-30% IACS Higher strength but lower conductivity

Oxygen Free Copper for Vacuum and Semiconductor Applications

Oxygen free copper is widely used in semiconductor manufacturing equipment and vacuum systems because of its low gas release characteristics and excellent purity.

In vacuum environments, oxygen and impurities contained in conventional copper materials may affect equipment performance. Oxygen free copper minimizes contamination risks and provides stable long-term operation.

  • Semiconductor processing chambers
  • Vacuum sealing components
  • RF and microwave equipment
  • Vacuum furnace components
  • Particle accelerator components
  • Precision electronic equipment

Heat Transfer Applications of Oxygen Free Copper

Due to its excellent thermal conductivity, oxygen free copper is widely applied in heat exchange systems and thermal management equipment where rapid heat transfer is required.

The combination of high thermal conductivity, corrosion resistance and good forming performance makes OFC suitable for advanced cooling solutions.

Application Advantages
Heat Exchanger Tubes High heat transfer efficiency and corrosion resistance
Cooling Plates Fast thermal dissipation for electronic systems
Laser Cooling Systems Stable performance under high heat loads
Power Electronics Cooling Reliable thermal management

Oxygen Free Copper Compared with Other Copper Materials

Oxygen free copper provides better purity and reliability compared with conventional copper grades. The selection depends on conductivity requirements, mechanical strength and application environment.

Material Purity Conductivity Main Applications
Oxygen Free Copper ≥99.95% Excellent Semiconductor, vacuum, precision electrical
Pure Copper C11000 ≥99.90% Excellent Electrical cables, motors, transformers
Aluminum Bronze Copper Alloy Medium Marine, wear-resistant applications
Brass Copper-Zinc Alloy Lower Valves, fittings, decorative parts

Machining and Fabrication of Oxygen Free Copper

Oxygen free copper has excellent ductility and can be manufactured into various shapes including tubes, plates, rods, wires and precision components.

  • Excellent cold forming capability
  • Suitable for machining and CNC processing
  • Good welding and brazing performance
  • Excellent surface finishing capability
  • Available in customized dimensions

For semiconductor and vacuum applications, special cleaning and surface treatment processes can be provided to meet strict cleanliness requirements.

Quality Control and Testing

Every oxygen free copper product is manufactured under strict quality control procedures to ensure purity, conductivity and dimensional accuracy.

  • Chemical composition analysis by spectrometer
  • Oxygen content testing
  • Electrical conductivity testing
  • Mechanical property inspection
  • Dimensional tolerance inspection
  • Surface quality inspection
  • Non-destructive testing when required

Packaging and Transportation

Oxygen free copper products require careful packaging to prevent surface damage, oxidation and contamination during transportation.

According to product type and customer requirements, we provide professional packaging solutions for copper plates, tubes, bars and precision components.

  • Vacuum packaging for semiconductor applications
  • Anti-moisture protection during sea transportation
  • Wooden cases for precision copper components
  • Protective film for copper plates and sheets
  • Complete MTC and inspection reports supplied

We support international transportation by sea, air and express delivery according to customer's delivery schedule and application requirements.

JIS BC3 Copper Plate

JIS BC3 (JIS H5111) plate

Standard Products

Oxygen Free Copper

Equivalent designations per JIS and CDA/ASTM standards, including Mitsubishi OFC grades.

Standard System Grade / Designation Common Name
JIS C1011, C1020, C1100, C1220 Oxygen-Free / Tough Pitch / Phosphorus-Deoxidized Copper
CDA / ASTM C10100, C10200, C11000, C12200 Oxygen-Free / Tough Pitch / Phosphorus-Deoxidized Copper

Applications of Oxygen Free Copper

Oxygen free copper is mainly used in high-performance applications where maximum electrical conductivity, excellent purity, corrosion resistance and long service life are required. Due to its extremely low oxygen content and minimal impurities, C10100 oxygen free copper provides superior electrical and thermal performance compared with conventional copper materials.

By removing almost all metallic impurities and oxygen during production, oxygen free copper maintains a highly uniform copper structure with fewer interruptions to electron flow. This results in lower electrical resistance, reduced heat generation during current transmission and improved long-term reliability.

Application Field Why Oxygen Free Copper is Selected Typical Products
High-end Audio and Visual Equipment Excellent electrical conductivity and signal transmission stability. Used where extremely low signal loss and high sound quality are required. Oxygen free copper wire, cable conductor, precision connectors
Large Industrial Transformers Higher conductivity allows smaller conductor diameter, reducing copper consumption and equipment size while improving energy efficiency. Transformer winding, electrical conductors, bus bars
Long Life Electrical Systems Excellent oxidation resistance and stable electrical properties provide extended service life for difficult-to-replace installations. Power equipment, electrical connections, precision components
High Vacuum Equipment Extremely low impurity level and low outgassing characteristics prevent contamination in vacuum environments. Vacuum chambers, semiconductor equipment, scientific instruments
Particle Accelerators and Scientific Equipment High purity and excellent conductivity meet the strict requirements of advanced scientific facilities. Accelerator components, electromagnetic systems
Frequently Asked Questions
Oxygen Free Copper (OFC) is a high-purity copper material manufactured with extremely low oxygen content. It provides excellent electrical conductivity, thermal conductivity, ductility and corrosion resistance, making it suitable for high-performance electrical, vacuum and semiconductor applications.
The most common oxygen free copper grades are C10100 (OFE copper) and C10200 (OF copper) according to ASTM standards. C10100 provides the highest purity with copper content above 99.99%, while C10200 offers excellent conductivity with copper content above 99.95%.
C10100 oxygen free copper has higher purity and lower oxygen content than C10200, making it preferred for ultra-high purity applications such as semiconductor equipment, vacuum systems and scientific instruments. C10200 is widely used for general high conductivity electrical applications.
Oxygen free copper is used in specialized applications requiring high conductivity, purity and reliability, including high-end audio cables, industrial transformers, semiconductor equipment, vacuum chambers, particle accelerators, electrical connectors and precision electronic components.
Oxygen content affects copper performance because oxygen can create impurities and reduce conductivity. Oxygen free copper minimizes oxygen levels, improving electrical performance, reducing oxidation and preventing hydrogen embrittlement during high-temperature processing.
Oxygen free copper typically provides electrical conductivity of approximately 100% IACS or higher. C10100 copper can reach around 101-102% IACS, making it one of the most conductive engineering metals available.
Oxygen free copper offers high purity, low outgassing characteristics and excellent thermal conductivity. These properties make it suitable for semiconductor manufacturing equipment, vacuum chambers, cooling components and precision electronic systems.
Yes. Oxygen free copper is widely used in high vacuum applications because of its extremely low impurity level and low gas release performance. It helps prevent contamination in vacuum systems, scientific equipment and semiconductor processing tools.
Oxygen free copper can be supplied in various forms including copper tubes, plates, sheets, rods, bars, wires and customized machined components according to customer requirements.
Both materials contain high copper content, but oxygen free copper has much lower oxygen and impurity levels. This provides better conductivity stability, improved vacuum performance and higher reliability compared with standard pure copper.
Oxygen free copper provides excellent corrosion resistance because of its high purity and reduced impurities. It performs well in electrical, vacuum and industrial environments where long-term stability is required.
Yes. Oxygen free copper has excellent welding and brazing characteristics. Its low oxygen content reduces the risk of embrittlement during joining processes, making it suitable for precision fabrication.
Oxygen free copper is commonly supplied according to ASTM, EN and JIS standards. Typical grades include ASTM C10100 and C10200, with material certificates available according to customer requirements.
Oxygen free copper is widely used in semiconductor, electronics, electrical power, renewable energy, aerospace, scientific research, vacuum technology and industrial heat transfer industries.
The higher electrical conductivity of oxygen free copper allows transformers to achieve efficient current transmission with reduced resistance losses. In some designs, it can also reduce conductor size and overall equipment dimensions.
Oxygen free copper has a melting point of approximately 1083°C and can operate continuously at elevated temperatures depending on design conditions, atmosphere and application requirements.
Yes. Customized oxygen free copper products including tubes, plates, rods, wires and precision-machined components can be supplied according to drawings, dimensions, surface requirements and application conditions.
Oxygen free copper products are professionally packaged with moisture protection, surface protection and suitable export packing methods. Vacuum packaging and special protection can be provided for semiconductor and high-purity applications.
To provide an accurate quotation, please specify copper grade (C10100 or C10200), product type, dimensions, quantity, surface requirements, application conditions and required delivery schedule.

How is Oxygen-Free Copper Made?

C101 / CW008A is produced under strictly controlled inert or vacuum conditions to minimize oxygen content.

Manufacturing Process

The production of C101 Oxygen-Free Copper follows the same upstream refining as standard high-purity copper, with one critical difference: the final refining and casting stage.

  • Standard ETP Copper: Refined in air; residual oxygen remains within acceptable limits.
  • OFC (C101): Final refining, melting, and casting are performed in a strictly oxygen-free environment.

This is typically achieved using:

  • Vacuum induction melting
  • Controlled inert atmosphere (Argon)

Cost & Selection Logic

Because the entire final refining and casting process must be conducted under tightly controlled atmospheric conditions, C101 OFC is the most expensive commercially available copper grade.

It is specified only when ultra-low oxygen content is mandatory, such as:

  • Semiconductor and high-vacuum components
  • Superconducting and cryogenic applications
  • High-fidelity audio and precision electronics

Oxygen-Free Copper (OFC)

High-purity copper with ultra-low oxygen content and no deoxidant residues. Specified for critical electrical, electronic, and cryogenic applications.

Definition & Purity Limits

Oxygen-Free Copper is defined as copper containing no oxygen and no residual deoxidizing agents. In practice, trace amounts of oxygen and impurities are controlled within strict limits:

  • Oxygen (O): ≤ 0.003 %
  • Total Impurities: ≤ 0.05 %
  • Copper Purity: ≥ 99.95 %

OFC Grade Classification

Grade Cu Purity (≥ %) Oxygen O (≤ %) Total Impurities (≤ %)
Grade 1 OFC 99.97 0.003 0.03
Grade 2 OFC 99.95 0.003 0.05

Key Properties

  • No hydrogen embrittlement — suitable for reducing atmospheres and welding.
  • Excellent electrical conductivity and thermal transfer.
  • Superior workability — bending, forming, and machining.
  • Good corrosion resistance and low-temperature performance.

Note: Oxygen limits vary slightly between national standards (GB, ASTM, JIS, DIN). Always verify compliance against the applicable purchasing specification.

Ultra-High Purity & Specialty Grades

Beyond standard OFC, ultra-high purity grades are specified for high-end audio, vacuum electronics, and precision signal transmission:

  • Standard OFC: 99.995 % Cu — used in audio cables, vacuum tubes, and general electronics.
  • LC-OFC (Linear Crystal OFC): ≥ 99.995 % Cu with optimized grain structure for signal integrity.
  • OCC (Single Crystal OFC): ≥ 99.996 % Cu, produced via Ohno Continuous Casting.
  • UP-OCC (Ultra Pure OCC): Single-crystal structure with no grain boundaries, offering minimal electrical impedance and superior signal transmission.
Iridium Unique Properties

Sunny Steel supplies Oxygen Free Copper materials in various forms to meet different industrial manufacturing requirements.

Oxygen Free Copper Tube

Oxygen Free Copper Rod

Oxygen Free Copper Plate

Oxygen Free Copper Coil

Oxygen Free Copper Foil

Oxygen Free Copper Sheet

Oxygen Free Copper Bar

Oxygen Free Copper Components

Oxygen Free Copper Wire

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