Iridium Tube
High-purity iridium tubes for crystal growth, semiconductor processing, laboratory furnaces and high-temperature industrial equipment.
High-purity iridium sputtering targets engineered for advanced PVD coating, semiconductor fabrication and precision thin-film deposition.
Premium Iridium Sputtering Targets for Semiconductor Manufacturing, Optical Coatings, MEMS and Advanced Thin-Film Deposition Applications
Iridium sputtering targets are manufactured from high-purity iridium and are designed for advanced physical vapor deposition (PVD) processes. Owing to their exceptional thermal stability, corrosion resistance and excellent electrical conductivity, iridium targets are widely used in semiconductor manufacturing, optical coatings, MEMS devices, OLED production and scientific research.
Sunny Steel supplies planar targets, rotary targets and bonded iridium targets in a wide range of dimensions. All products are manufactured under strict quality control procedures to ensure high purity, excellent density, uniform grain structure and consistent sputtering performance.
Custom sizes, backing plate bonding and precision machining services are available according to customer drawings and deposition equipment requirements.
Iridium sputtering targets are manufactured from high-purity iridium sputtering targets are widely used in semiconductor manufacturing, optical coatings, MEMS devices, OLED production and scientific research.
| Item | Specification |
|---|---|
| Material | Pure Iridium |
| Purity | 99.95% / 99.99% |
| Shape | Planar / Rotary / Custom |
| Density | ≥99% Theoretical Density |
| Diameter | 25–300 mm |
| Thickness | 1–20 mm |
| Surface Finish | Ground / Precision Machined |
| Bonding | Indium Bond / Elastomer Bond / Direct Bond |
Iridium sputtering targets are widely used to deposit high-performance thin films across a broad range of semiconductor applications. In microelectronic device fabrication, iridium films function as electrodes, diffusion barriers and conductive layers, leveraging the metal’s excellent electrical conductivity and outstanding thermal stability.
In advanced manufacturing processes—including integrated circuits (ICs), microelectromechanical systems (MEMS) and high-frequency radio frequency (RF) devices— precise and repeatable thin-film deposition is critical. Iridium sputtering targets enable the formation of ultra-thin films with uniform thickness, minimal defect density and excellent interfacial quality. These characteristics directly support device performance, yield and long-term reliability.
A leading semiconductor manufacturer developing resistive random-access memory (ReRAM) and phase-change memory (PCM) encountered performance limitations with conventional electrode materials such as platinum. Under the elevated temperatures required during device operation, these materials exhibited degradation, compromising both structural integrity and electrical performance.
By adopting high-purity iridium sputtering targets, the manufacturer achieved thermally stable thin films capable of maintaining excellent conductivity and mechanical robustness throughout the device lifecycle. The result was a measurable improvement in reliability and service life, providing a distinct competitive advantage in the advanced memory market.
A MEMS specialist required ultra-thin, highly conductive films for sensors deployed in high-temperature industrial environments. Conventional metallic films lacked the necessary thermal stability and oxidation resistance, resulting in premature sensor failure.
Switching to iridium sputtering targets enabled the deposition of dense, defect-free films that retained their properties under prolonged thermal stress. The enhanced durability and measurement accuracy allowed the company to expand into aerospace and automotive markets, where component reliability under extreme conditions is mission-critical.
A semiconductor supplier developing high-frequency RF devices faced challenges with existing metallization materials, which degraded under intense electrical and thermal loads. This degradation led to signal loss, reduced efficiency and higher field failure rates.
Iridium sputtering targets delivered superior electrical conductivity and interfacial stability, ensuring consistent RF performance even under aggressive operating conditions. The outcome included improved signal integrity, extended device service life and higher customer satisfaction—strengthening the company’s position in the high-frequency device segment.
While precious metals such as platinum, palladium and gold are widely used in physical vapor deposition (PVD) processes, iridium delivers distinct advantages in applications that demand extreme thermal stability, corrosion resistance and long-term reliability.
These combined attributes make iridium sputtering targets the preferred choice for cutting-edge applications in memory, logic, MEMS and RF devices, where process stability, film quality and device reliability are critical.
To ensure reliable performance in demanding industrial environments, every iridium crucible is manufactured under strict quality control procedures and inspected before delivery.
Iridium is a platinum group metal distinguished by its exceptional physical and chemical stability. With a melting point of 2446°C, it remains structurally stable under extreme thermal conditions where most metals fail. Its outstanding resistance to aggressive chemicals further enhances its durability in the most demanding industrial environments.
These properties make iridium an ideal material for sputtering targets, where consistent performance under extreme temperatures is critical. Its high density and hardness promote the formation of thin films with excellent structural integrity—essential for the production of reliable, long-lifetime semiconductor devices.
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Cast basalt lined steel pipe is composed by lined with cast basalt pipe, outside steel pipe and cement mortar filling between the two layers.
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